PI (Physik Instrumente) has introduced a new technology platform designed to accelerate electro-optical wafer-level testing for photonic integrated circuits (PICs). The system combines high-density electrical probing with automated photonic alignment, allowing electrical and optical device functions to be validated simultaneously in high-volume manufacturing environments.
The platform is aimed at manufacturers seeking to move beyond sequential, laboratory-style alignment processes towards scalable and repeatable wafer-level testing. Its compact architecture has also been developed for compatibility with automated test equipment (ATE).
Parallel Alignment Engines Target Higher Wafer Testing Throughput
A central feature of PI’s new platform is its ability to operate multiple miniaturised piezoelectric alignment engines in parallel across a single wafer.
This approach enables simultaneous electro-optical probing at several test sites rather than testing each location sequentially. According to PI, parallel operation can increase manufacturing throughput while reducing the overall cost of testing.
The compact design allows multiple alignment engines to be incorporated into a single test configuration. This could be particularly significant for electro-photonic integrated circuit (EPIC) manufacturers as production volumes increase and more efficient testing processes become necessary.
For Australia’s growing semiconductor, quantum technology and photonics sectors, advances in scalable testing technology are relevant as research organisations and manufacturers seek to translate sophisticated photonic devices from laboratory development into commercial production.
ATE-Compatible Architecture Supports Production Scaling
PI said the platform’s ATE-compatible architecture was developed with high-volume production requirements in mind.
Automated alignment is especially important in photonic wafer testing because optical fibres must be positioned with high precision relative to components fabricated on the wafer. Small positioning variations can affect optical coupling and potentially influence the reliability and repeatability of test results.
By combining electrical probing and optical alignment within the same platform, the technology is intended to simplify electro-optical validation while allowing manufacturers to scale the number of test sites operating simultaneously.
FAU Ranging Measures Fibre-to-Wafer Distance
Another key feature is FAU ranging, an interferometry-based fly-height measurement technique designed to determine the distance between the fibre and wafer at the relevant test location.
The technology uses existing fibre channels, meaning it does not require additional hardware or take up extra space within the test configuration.
PI said this measurement capability supports stable probing and repeatable optical coupling by providing precise information about the fibre-to-wafer distance.
The approach could be valuable in high-volume manufacturing, where consistent alignment across large numbers of devices is necessary to maintain reliable testing and production efficiency.
Technology Could Support Photonic Edge Coupling
PI said FAU ranging could also support future testing approaches involving trench-based photonic edge coupling.
Such techniques could help manufacturers make more efficient use of available wafer space, potentially lowering device costs while giving designers greater flexibility in the development of electro-photonic integrated circuits.
“With FAU ranging, we pave the way for trench-based photonic edge coupling, saving wafer real estate, reducing device costs, and unlocking new design freedom for EPIC manufacturers,” said Dr Markus Simon, Strategic Innovation and Technology Management at PI.
PI Targets Scalable Photonics Manufacturing
The introduction of the miniaturised alignment engine platform reflects the broader industry’s push towards higher-volume manufacturing of photonic integrated circuits.
As PICs are increasingly developed for telecommunications, data centres, sensing, quantum technologies and other advanced applications, efficient wafer-level testing is becoming an important part of scaling production.
By combining parallel piezoelectric alignment, electrical probing and fibre-based fly-height sensing, PI’s platform is designed to address some of the precision and throughput challenges associated with electro-optical device testing.
PI said it will present the technology at SPIE Photonics West 2026. The platform highlights the industry’s continuing shift towards automated and parallel testing methods as photonic devices move from specialised development environments into larger-scale manufacturing.
Cory Weinberg is a contributor to Sproutwired.com, covering a wide range of topics including news, politics, business, technology, sport, entertainment and lifestyle. He focuses on delivering clear, balanced reporting that helps readers stay informed about current events and emerging developments. Cory’s work highlights relevant stories, practical insights and important issues affecting communities and industries, with an emphasis on accuracy, clarity and information that readers can trust.
